The semiconductor industry is witnessing significant technological innovations that are reshaping businesses across the chipset ecosystem. With mounting pressure to increase the performance of systems on chips (SoCs), chipmakers have been facing challenges to integrate more transistors on a standard silicon die. With increasing complexities and rising demand across edge AI and AIoT applications, chiplets offer a promising alternative to provide chipmakers the flexibility to dynamically modify a chipset’s architecture, based on AIoT application requirements.
Chiplets are modular, discrete semiconductor components that are designed and developed individually with specific functions. Unlike monolithic systems-on-chips, which have all the functional units such as compute, I/O, memory, and storage assembled onto a single die, chiplets disaggregate the functional units into multiple specialised dies and integrate them together into a single package.
Automotive OEMs are increasingly exploring chiplets as a potential chipset solution to meet the rising compute demands of connected vehicles applications. The modular architecture of chiplets enables OEMs to modify hardware designs without overhauling the entire systems, while also allowing customisation by selecting chiplets tailored to specific requirements.
This report discusses what chiplets are and why they are gaining traction. We highlight the benefits of chiplets that make them a potential alternative for multiple AIoT applications. Also, we discuss the interconnect and packaging technologies essential for widespread chiplet adoption. Furthermore, the report covers the strategic push by governments with less advanced chipmaking manufacturing prowess to develop chiplets to compete in the dynamic semiconductor market and lower dependence on big chipmakers.
Finally, the report lists some of the major vendors that provide AIoT-focused chiplets.
